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New bond issue: Xi'an Aerospace High-Tech Industry Development issued international bonds (XS2177109878) with a 3.95% coupon for USD 200.0m maturing in 2023

May 21, 2020 | Cbonds

May 19, 2020 Xi'an Aerospace High-Tech Industry Development issued international bonds (XS2177109878) with a 3.95% for USD 200.0m maturing in 2023. Depository: Clearstream Banking S.A., Euroclear Bank
Bookrunner: Bank of Communications, China Minsheng Banking, China Securities (International) Finance, DongXing Securities, Fosun Hani Securities, Industrial Bank, Shanghai Pudong Development Bank.

发行 Xi'an Aerospace High-Tech Industry Development, 3.95% 26may2023, USD

状态风险国家赎回(报价)容量排放评级(M / S& P / F)
outstandingChina26.05.2023200.000.000 USD-/-/-

公司: Xi'an Aerospace High-Tech Industry Development

完整的公司名称Xi'an Aerospace High-Tech Industry Development Co., Ltd
风险国家China
行业Engineering industry

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